CSDM series Special Diamond Micron Powder is the use of high-quality single crystal diamond CSD series of raw materials, precision production and processing technology, crushing, shaping, purification, special acid treatment, grading and other processes processed. mainly used in the production of PCD, PDC,TSP and diamond wire saws.
Grades
Size |
CSDM-PCD/PDC |
CSDM-TSP |
CSDM-WS |
0-0.5 |
Y |
Y |
Y |
0-1 |
Y |
Y |
Y |
0-2 |
Y |
Y |
Y |
1-2 |
Y |
Y |
Y |
1-3 |
Y |
Y |
Y |
2-3 |
Y |
Y |
Y |
2-4 |
Y |
Y |
Y |
2-5 |
Y |
Y |
Y |
3-5 |
Y |
Y |
Y |
4-6 |
Y |
Y |
Y |
4-8 |
Y |
Y |
Y |
5-7 |
Y |
Y |
Y |
5-10 |
Y |
Y |
Y |
6-12 |
Y |
Y |
Y |
7-10 |
Y |
Y |
Y |
8-12 |
Y |
Y |
Y |
8-16 |
Y |
Y |
Y |
10-14 |
Y |
Y |
Y |
10-20 |
Y |
Y |
Y |
14-20 |
Y |
Y |
Y |
12-22 |
Y |
Y |
Y |
15-25 |
Y |
Y |
Y |
20-28 |
Y |
Y |
Y |
20-30 |
Y |
Y |
Y |
22-36 |
Y |
Y |
Y |
20-40 |
Y |
Y |
Y |
28-40 |
Y |
Y |
Y |
30-40 |
Y |
Y |
Y |
40-50 |
Y |
Y |
Y |
40-60 |
Y |
Y |
Y |
China standard |
International standard |
Japanese standard/ Mesh (#)
|
Russia
GOST9206-80 |
Median D50 (μm)
|
w0.2 |
0-0.2 |
80000 |
|
0.1 |
w0.25 |
0-0.25 |
60000 |
|
0.11~0.20 |
w0.5 |
0-0.5 |
30000 |
0.5/0 |
0.20~0.30 |
w1 |
0-1 |
15000 |
1/0 |
0.6~0.8 |
w1.5- |
0-2 |
13000 |
|
0.8~1.0 |
w1.5 |
1-2 |
12000 |
2/1 |
1.1~1.3 |
w2.5 |
1-3 |
10000 |
|
1.6~1.8 |
W3 |
2-3 |
7000 |
3/2 |
1.9~2.1 |
w3.5 |
2-4 |
6000 |
|
2.6~3.0 |
W5- |
2-5 |
5000 |
5/3 |
3.1~3.4 |
w5 |
3-6 |
4000 |
|
3.5~4.2 |
W5+ |
4-6 |
3500 |
|
4.4~5.0 |
w7 |
4-8 |
3000 |
7/5 |
5.0~6.0 |
W7+ |
4-9 |
2500 |
|
6.1~6.5 |
w10- |
5-10 |
2000 |
10/7 |
6.5~7.3 |
w10 |
6-12 |
1800 |
|
7.3~8.3 |
w10+ |
8-12 |
1600 |
|
8.3~9.0 |
w14- |
7-14 |
1500 |
|
9.1~10.5 |
w14 |
8-16 |
1300 |
14/10 |
10.0~12.0 |
w20- |
10-20 |
1200 |
|
12.5~15.0 |
w20 |
12-22 |
1000 |
20/14 |
15.0~17.0 |
w20+ |
15-25 |
800 |
|
18.0~20.0 |
w28 |
20-30 |
700 |
28/20 |
20~23 |
w28+ |
22-36 |
600 |
|
23~26 |
w40- |
20-40 |
500 |
|
26~29 |
w40 |
30-40 |
450 |
40/28 |
29~32 |
w40+ |
35-45 |
400 |
|
32~36 |
w50 |
40-60 |
350 |
60/40 |
37~43 |
TOP
Description
CSDM series Special Diamond Micron Powder is the use of high-quality single crystal diamond CSD series of raw materials, precision production and processing technology, crushing, shaping, purification, special acid treatment, grading and other processes processed. mainly used in the production of PCD, PDC,TSP and diamond wire saws.
CSDM-PCD/PDC
Features: high strength, high purity CSD series diamond as raw material, using sophisticated production process, after crushing, shaping, special purification and special acid and alkali processing, classification and other processing procedures, the product is a pale yellow, crystalline rules, particle size distribution, uniform concentration, the impurity content is controlled within a few parts per million-less than 5PPM, and good thermal stability, wear-resisting performance is high. The micro-powder surface through special craft processing, the particle surface smooth and clean, more conducive to the composite sheet, a crystal stable growth.
Uses: applicable to the production of PCD tool with a composite sheet, PDC oil field coal field with the composite sheet and cobalt-based CD wire drawing dies mold core, etc.
CSDM–TSP
Features: high quality CSD series diamond as raw material, using sophisticated production process, by crushing, plastic, purification, special acid and alkali processing, classification and other processing procedures, the product is a pale yellow, crystalline rules, uniform particle size distribution is concentrated, the impurities content is extremely low, good thermal stability, wear-resisting performance is high.
Uses: applicable to the production of PDC of the stone with a composite sheet, the TSP and the silicon poly crystal drawing dies cores, etc.
CSDM-WS
Features: made of high strength CSD series diamond as raw material, using advanced production processing technology, by crushing, plastic, purification, grading, etc. is processed, the product is a pale yellow, crystalline rules, was close to the equal-area-shaped oval-shaped particles, the particle size is concentrated and uniform, the impurity content is very low, strong wear resistance, good dispersion.
Uses: suitable for production of diamond wire saw or other diamond cutting tools used for cutting sapphire, polycrystalline silicon, single crystal silicon, sapphire, quartz plate, LED display, LCD glass, magnetic materials, semiconductor and other value the precious and fragile high-tech materials.