CSDM series General Diamond Micron Powder can be widely used for cutting, grinding, polishing etc. Is polishing carbide, ceramics, gems, optical glass high hardness materials ideal raw material. Is widely used in machinery, aerospace, optical instrument, glass, ceramics, electronics, petroleum, geology, military industrial sector.
Grade
Size |
ACM |
CSDM-D |
CSDM-C |
CSDM-B |
CSDM-A |
0-0.05 |
|
|
Y |
Y |
Y |
0-0.1 |
|
|
Y |
Y |
Y |
0-0.125 |
|
|
Y |
Y |
Y |
0-0.2 |
|
Y |
Y |
Y |
Y |
0-0.25 |
|
Y |
Y |
Y |
Y |
0-0.5 |
Y |
Y |
Y |
Y |
Y |
0-1 |
Y |
Y |
Y |
Y |
Y |
0-2 |
Y |
Y |
Y |
Y |
Y |
1-2 |
Y |
Y |
Y |
Y |
Y |
1-3 |
Y |
Y |
Y |
Y |
Y |
2-3 |
Y |
Y |
Y |
Y |
Y |
2-4 |
Y |
Y |
Y |
Y |
Y |
2-5 |
Y |
Y |
Y |
Y |
Y |
3-5 |
Y |
Y |
Y |
Y |
Y |
4-6 |
Y |
Y |
Y |
Y |
Y |
4-8 |
Y |
Y |
Y |
Y |
Y |
5-7 |
Y |
Y |
Y |
Y |
Y |
5-10 |
Y |
Y |
Y |
Y |
Y |
6-12 |
Y |
Y |
Y |
Y |
Y |
7-10 |
Y |
Y |
Y |
Y |
Y |
8-12 |
Y |
Y |
Y |
Y |
Y |
8-16 |
Y |
Y |
Y |
Y |
Y |
10-14 |
Y |
Y |
Y |
Y |
Y |
10-20 |
Y |
Y |
Y |
Y |
Y |
14-20 |
Y |
Y |
Y |
Y |
Y |
12-22 |
Y |
Y |
Y |
Y |
Y |
15-25 |
Y |
Y |
Y |
Y |
Y |
20-28 |
Y |
Y |
Y |
Y |
Y |
20-30 |
Y |
Y |
Y |
Y |
Y |
22-36 |
Y |
Y |
Y |
Y |
Y |
20-40 |
Y |
Y |
Y |
Y |
Y |
28-40 |
Y |
Y |
Y |
Y |
Y |
30-40 |
Y |
Y |
Y |
Y |
Y |
40-50 |
Y |
Y |
Y |
Y |
Y |
40-60 |
Y |
Y |
Y |
Y |
Y |
50-60 |
Y |
Y |
Y |
Y |
Y |
China
standard |
International
standard |
Japanese standard
/Mesh (#) |
Russia
GOST9206-80 |
Median
D5 (μm) |
w0.2 |
0-0.2 |
80000 |
|
0.1 |
w0.25 |
0-0.25 |
60000 |
|
0.11~0.20 |
w0.5 |
0-0.5 |
30000 |
0.5/0 |
0.20~0.30 |
w1 |
0-1 |
15000 |
1/0 |
0.6~0.8 |
w1.5- |
0-2 |
13000 |
|
0.8~1.0 |
w1.5 |
1-2 |
12000 |
2/1 |
1.1~1.3 |
w2.5 |
1-3 |
10000 |
|
1.6~1.8 |
W3 |
2-3 |
7000 |
3/2 |
1.9~2.1 |
w3.5 |
2-4 |
6000 |
|
2.6~3.0 |
W5- |
2-5 |
5000 |
5/3 |
3.1~3.4 |
w5 |
3-6 |
4000 |
|
3.5~4.2 |
W5+ |
4-6 |
3500 |
|
4.4~5.0 |
w7 |
4-8 |
3000 |
7/5 |
5.0~6.0 |
W7+ |
4-9 |
2500 |
|
6.1~6.5 |
w10- |
5-10 |
2000 |
10/7 |
6.5~7.3 |
w10 |
6-12 |
1800 |
|
7.3~8.3 |
w10+ |
8-12 |
1600 |
|
8.3~9.0 |
w14- |
7-14 |
1500 |
|
9.1~10.5 |
w14 |
8-16 |
1300 |
14/10 |
10.0~12.0 |
w20- |
10-20 |
1200 |
|
12.5~15.0 |
w20 |
12-22 |
1000 |
20/14 |
15.0~17.0 |
w20+ |
15-25 |
800 |
|
18.0~20.0 |
w28 |
20-30 |
700 |
28/20 |
20~23 |
w28+ |
22-36 |
600 |
|
23~26 |
w40- |
20-40 |
500 |
|
26~29 |
w40 |
30-40 |
450 |
40/28 |
29~32 |
w40+ |
35-45 |
400 |
|
32~36 |
w50 |
40-60 |
350 |
60/40 |
37~43 |
TOP
Description
CSDM series General Diamond Micron Powder refers to a particle size finer than 60/40 micron diamond particles, is made of high quality single crystal diamond as raw material, through crushing, shaping, purifying, grading and other processes processing. diamond powder high hardness, good wear resistance, can be widely used for cutting, grinding, polishing etc. is polishing carbide, ceramics, gems, optical glass high hardness materials ideal raw material. Is widely used in machinery, aerospace, optical instrument, glass, ceramics, electronics, petroleum, geology, military industrial sector, as the technology and products continues to develop, the diamond powder and products of use in the field is constantly widening.
ACM
Features: made of high quality resin bonded diamond AC6 as raw material, using advanced production processing technology, by crushing, plastic, purification, grading, etc. is processed, the product is light gray, crystalline rules, low impurity content, magnetic low, self-sharpening is very good, A class A polycrystalline structure, shape and particle size distribution to give precise control.
Uses: applicable to the production of resin bond abrasive, grinding paste, grinding fluid, etc., used for fine polishing of the hard alloy, optical glass and the quality of the products requires extremely high precision polishing in the field.
CSDM-D
Features: made of high quality resin bonded diamond RVD as raw material, using advanced production processing technology, by crushing, plastic, purification, grading and other processes processing, products are light yellow green, crystalline form a relatively regular, low impurity content, a good self-sharpening, particle size distribution uniform.
Uses: applicable to the production of resin-bonded grinding tools, vitrified abrasive, grinding paste, grinding fluid, etc., used for polishing gem, stone, ceramic tiles, glass, optical glass and hard alloy, etc. brittle material, economic type resin Diamond micro powder, has a high grinding resistance and wear resistance.
CSDM-C
Features: universal micro-powder, made of high quality single crystal synthetic diamond CSD10 as raw material, using advanced production processing technology, by crushing, plastic, purification, grading, etc. is processed, the product is a pale yellow, crystalline form a of the rules, the impurity content is low, magnetic low, particle size distribution uniform.
Uses: applicable to the production of metal-bonded grinding tools, vitrified abrasive, resin bond abrasive, grinding paste, grinding fluid, etc., used for polishing gem, glass, optical glass, ceramics, stone, PCD/PCBN, etc. non-metallic materials.
CSDM-B
Features: high strength micro powder is made of high quality single crystal diamond CSD20 as raw material, using advanced production processing technology, by crushing, plastic, purification, grading, etc. is processed, the product is a pale yellow, crystalline rules, low impurity content, magnetic low, particle size distribution concentrated.
Uses: applicable to the production of metal-bonded abrasives, vitrified abrasives, electroplated abrasive tools, grinding paste, grinding fluid, etc., for the production of optical glass precision grinding, optical grinding pills films, optical grinding wheels, precision polishing pads, silicon material of sapphire precision grinding wheels, gem Jade precision machining tool, a cutting single crystal silicon, sapphire wire, etc.
CSDM-A
Features: high strength micro powder, is the choice of high strength high quality single crystal diamond CSD30 as raw material, using advanced production processing technology, by crushing, plastic, purification, grading, etc. is processed, the product is a pale yellow, crystalline rules, impurity content is extremely low, magnetic low and the particle size distribution is concentrated, high strength, has excellent dispersibility and wear resistance.
Uses: applicable to the production of metal-bonded tools, ceramic bonded tools, electroplated tools, etc., for organic, inorganic brittle material cutting, grinding, polishing. Such as: cutting the Silicon single crystal Sapphire wire saw, gem and semiconductor and other precision cutting blade, also suitable for single-crystal silicon, polycrystalline silicon, Diamond, gem, Sapphire, quartz plate, LED Sapphire substrates, LCD Glass, high-precision magnetic material, semiconductor and other high-tech materials of grinding, polishing tools.