2008 super-hard material products is expected to launch new products, may main are:
1, The new cutting blade rules for the orderly distribution of the diamond blade, make the service life increased by 50% to 100%.
2, ultra-thin cutting discs precision machining of the dicing Blade of the semiconductor processing tool, may be made large progress.
3, High speed grinding wheels to the automotive industry with high-speed grinding wheel, the Linear velocity is increased to 120 m/s or more.
4, a CVD Diamond thin film and nano-Diamond powder will gradually have new products put into application. These are high-end products, the popular market favor, is expected to replace imported products.
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